85360234
Jun 30, 2011
Apr 5, 2016
CONDUCTIVE AND INSULATING PASTE, FILM AND PELLET BASED ADHESIVES, COATINGS AND ENCAPSULANTS, NAMELY, SILICON, EPOXY AND ACRYLIC RESINS, USED AS STRUCTURAL ENCAPSULATION, BONDING AND/OR CONNECTING MATERIALS FOR THE ASSEMBLY OF COMPONENTS FOR MEDICAL OR ELECTRONIC BASED DEVICES AND ASSEMBLIES; INDUSTRIAL CHEMICALS, WATER SOLUBLE FLUXES, SOLVENT SOLUBLE FLUXES AND NO-CLEAN PASTE OR LIQUID FLUXES FOR USE IN THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; CHEMICALS USED IN CLEANING OF MICROELECTRONIC DEVICES AND ASSEMBLIES, AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRONIC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR THE USE IN THE PRINTED CIRCUIT BOARD INDUSTRY
ChemicalsSOLDERING MATERIALS CONTAINING METAL FOR USE IN THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; WATER SOLUBLE AND NO CLEAN SOLDER PASTES, SOLDER SPHERES, SOLDER PREFORMS, SOLDER RIBBON, SOLID SOLDER WIRE, FLUX CORED SOLDER WIRE, SOLDER COATED METAL STRIP, AND SOLDERS COMPRISED PRIMARILY OF LEAD AND TIN FOR THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER
Metal Goods