ACCRETECH

Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, dicing machine, and chemical mechanical planarizers; and machine parts therefor

Precision measuring machines, namely non-contact flatness measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three-dimensional measuring machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; optical apparatus/instruments, namely microscopes; electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; automatic distribution vending machines [ ; network system comprised of computer hardware and software for wafer probing machines ]