ACCRETECH

Metal working machines and tools, namely grinding machines, metal cutting machines; Semiconductor manufacturing equipment, namely wafer probing machine, wafer dicing machine, chemical mechanical grinders and back grinders; and machine parts therefor

Precision measuring machines, namely, wafer thickness measuring machine, digital length measuring machine, surface texture measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer [ ; Wafer inspection units ]