ABSOLICS

Semiconductor packages, namely, semiconductor chip sets; printed circuit boards; electronic circuit boards; flexible circuit boards; electronic integrated circuits; integrated circuit modules; 3D integrated circuits; large-scale integrated circuits; electronic memory circuits; circuit boards provided with integrated circuits; semiconductor packages being semiconductor chip sets; glass substrates in the nature of glass covered with an electrical conductor for use in semiconductors; daughter boards; digital circuit boards; motherboards; semiconductor boards; mother boards; lead frames for semiconductors, namely, semiconductor lead frames; memory modules; random access memory modules, namely, memory modules