Scientific and technical services, namely, designing engineering products in the nature of mechanical apparatus for manufacturing semiconductors; engineering services, namely, developing fine-pitch solder bumping technology for others; engineering services, namely, developing semiconductor wafer bumping technology for others; engineering services, namely, developing semiconductor packaging technology for others; providing consulting services to others, namely, technology consultation and research relating to integrated circuits; engineering services, namely, designing semiconductors or integrated circuits for others; engineering services, namely, designing semiconductors for others; engineering services, namely, designing integrated circuits for others; conducting product research in the field of semiconductor design; product development, namely, providing research, design and testing services to others relating to semiconductor development; conducting product research relating to semiconductors; providing consulting services relating to semiconductor technology; providing consulting services relating to semiconductor product design; engineering services, namely, conducting research in the field of semiconductor manufacture; providing new product design services to others relating to integrated circuits; product development, namely, designing electronic circuit substrates for others
Computer and Scientific