A-EASI

Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers, integrated circuits; integrated circuits that contain metal bumps; semiconductor substrate

Etching processing in the semiconductor wafer; manufacture of semiconductor, Integrated circuit, Integrated circuit board and wafer specified in the standard from customers; semiconductor packaging processing in the nature of manufacturing services for others; etching processing in integrated circuits; semiconductor wafer-level processing; wafer foundry, namely, manufacturing of semiconductor wafers for others; integrated circuit packaging processing in the nature of manufacturing services for others; semiconductor substrate processing and manufacturing; substrate foundry, namely, manufacturing of semiconductor substrates for others; manufacture of semiconductor substrate

Semiconductor related products technology research and development for others; Semiconductor packaging design; Integrated Circuit design; semiconductor substrate design; Quality inspection for semiconductors and related products; Testing for semiconductors and related products; quality identification for semiconductors and related products, namely, quality control for others