Etching of crystal wafers; Etching of integrated circuits; Semiconductor sealing processing, namely, encapsulation of semiconductors; Wafer Foundry, namely, custom manufacture of semiconductor wafers; Custom manufacture of semiconductors for others; Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions; Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions; Custom manufacturing and assembly of semiconductors and integrated circuits according to customer specifications; Manufacturing silicon wafers and integrated circuits according to customer specification and instructions; Custom manufacture of silicon wafers and integrated circuits; Polishing services for silicon wafers and semiconductors; Custom manufacture of integrated circuits, photomasks and electronic or computer chips for others; Foundry services of semiconductors and integrated circuits, namely, custom manufacture of semiconductors and integrated circuits; Semiconductor and integrated circuit packaging processing, namely, encapsulation of semiconductors; Foundry semiconductor chip cutting and packaging processing services, namely, custom manufacture of semiconductor chips; Wafer etching and dicing processing, namely, etching of semiconductor wafers; Etching processing, namely, etching of semiconductors and integrated circuits; Cutting or forming of integrated circuits, namely, custom manufacture of integrated circuits; Manufacturing and processing of integrated circuits, namely, custom manufacture of integrated circuits