Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integrated circuit; Electronic circuit; Printed circuit board; Semiconductor chip; Semiconductor component; Integrated circuit board; Semiconductor wafers; Wafer bumps being components of semiconductor chips and semiconductor devices; Semiconductor package containing semiconductors, semiconductor chip, or semiconductor device

processing of semiconductor packaging and integrated circuit packaging, namely, packaging articles to the order and specification of others

Etching and processing in the nature of custom manufacture of semiconductor wafers; etching and processing in the nature of custom manufacture of integrated circuits; processing in the nature of custom manufacture of semiconductor wafers; custom wafer manufacturing; custom manufacturing and processing in the nature of custom manufacture of substrates; manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards and semiconductor wafers to the order and specification of others

Research and development for others of semiconductors and related products; semiconductor packaging design for others; integrated circuit design for others; substrate design for others; quality evaluation for others of semiconductors and related products; testing of new products in the nature of semiconductors and related products, for others; quality control for others in the field of semiconductors and related products; technical consultation in the field of semiconductor packaging technology