Chemical preparations and agents used in the plating processes; copper sulphate; sputtering targets made of metal oxide, metal nitride or metal silicide for use in sputtering process of depositing a thin layer of metal oxide, metal nitride or metal silicide on substrates

Common metals, unwrought or semi-worked, for further manufacture; metal foil; stainless steels; foils and powder of copper or its alloys; metal sputtering targets; sputtering targets made of metal alloy for use in sputtering process of depositing a thin layer of metal alloy on substrates

Electrodes for use in sputtering process of depositing a thin layer of metal, metal alloy, metal oxide, metal nitride or metal silicide on substrates; semiconductors