THERMAL DEVICES AND COMPONENTS EMPLOYED TO DISSIPATE OR MEASURE HEAT, NAMELY, HERMETIC GLASS-TO-METAL PACKAGES TO ENCAPSULATE ELECTRONIC COMPONENTS, DIRECT BONDED COPPER SUBSTRATES AND HEAT SINKS TO SUPPORT ELECTRONIC COMPUTER COMPONENTS, AND THERMOSTATS TO CONTROL OVER-HEATING IN SMALL AND MAJOR APPLIANCES, AND OXYGEN AND HUMIDITY ELECTRONIC SENSORS FOR COMBUSTION CONTROL

THERMAL DEVICES AND COMPONENTS EMPLOYED TO DISSIPATE OR MEASURE HEAT; NAMELY, OXYGEN AND HUMIDITY SENSORS FOR MEDICAL APPLICATIONS