Metal working machines and tools, namely grinding machines, metal cutting machines; semiconductor manufacturing equipment, namely sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, and dicing machine, wafer inspection systems, chemical mechanical grinders and back grinders

Precision measuring machines, namely wafer thickness measuring machine, digital length measuring machine, surface texture measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, machine control gauge, electric micrometer, pneumatic micrometer; wafer inspection units