chemicals for use in manufacturing printed circuit boards and metallizing nonconductive substrates, namely, photosensitive resist developers, metal etchants, desmear and etchback treatment preparations, tin and solder and resist stripping preparations, chromate removers for copper surfaces, electroless copper plating processing agents consisting of micro etchants, pre-dips, catalysts, electroless copper colloids, anti-oxidants, accelerators, and acid treatment preparations, conductive carbon plating processing agents consisting of micro etchants; chemical immersion baths for use in the electroplating of conductive metals; solvent-type processing compositions, rinses, initiators, and neutralizers for electroplating printed circuit boards and electroless plating of nonconductive substrates

coatings for printed circuit boards and metallizing nonconductive substrates in the nature of, oxide and post-dip treatment preparations for metal surfaces, inner layer primers, anti-tarnish treatment preparations, organic soldering preservatives, conductive carbon colloids, and conditioners

cleaning preparations for use in manufacturing printed circuit boards and metallizing nonconductive substrates, namely, cleaning and cleaning/conditioner preparations