SEMICONDUCTOR PACKAGING PRODUCTS, NAMELY, STAMPED AND PLATED LEADFRAMES AND ETCHED LEAD FRAMES; FLEXIBLE INTERCONNECTS, NAMELY, FLEXIBLE CIRCUITS AND RIGID/FLEX CIRCUITS; ADVANCED PRINTED CIRCUITS, NAMELY, MULTILAYER CIRCUITS, SURFACE MOUNT DEVICE BOARDS AND HEAT SINK CIRCUITS; BACK PLANE AND BUSSING SYSTEMS, NAMELY, BUS BARS AND COMPLIANT PIN CONTACTS, SPECIALTY CIRCUITS, NAMELY, LARGE-SIZE CIRCUITS, MICROWAVE CIRCUITS, AND SPECIALTY METAL CIRCUITS; AND MICROCIRCUITS, NAMELY GATE ARRAYS AND THICK-FILM HYBRID CIRCUITS