3D INCITES

Providing recognition and incentives by the way of awards to demonstrate excellence in the field of heterogenous integration technologies; Providing a website featuring blogs and non-downloadable publications in the nature of articles, book reviews and white papers in the field(s) of advanced packaging, 3D and chiplet integration and heterogenous integration technologies; Providing online non-downloadable educational podcasts in the field of advanced packaging, 3D and chiplet integration and heterogenous integration technologies

Creating and hosting an on-line membership community web site for members of the semiconductor supply chain to share and access content in the fields of advanced packaging, 3D and chiplet integration and heterogenous integration technologies